Keystone Chapter

Future Meeting Dates

DATE	PROGRAM	LOCATION
February 17, 2005	“Copper bonding, Gold stud bump flip chip, and Nanotechnology materials", Lee Levine - K&S, K. Deepthi - Temple U., Son Nguyen - Temple U.	Kulicke & Soffa Willow Grove, PA
March 17	Substrates, Paste, and Pb free materials	Heraeus Conshohocken, PA
April 21	“Thick Film mini session"	Sefar Mt Holly, NJ
June 9, 2005	Keystone Symposium	NTCu Bethlehem, PA
September 25-29	IMAPS 2005	PA Convention Center, Philadelphia, PA